Capabilities
Call Us Today 760-560-0530Process Capability
| Item | Technical Sepecification | Remarks | ||||
|---|---|---|---|---|---|---|
| Standard | Advanced | |||||
| Number of layer | 1-8 Layers | 10-30 Layers | ||||
| Base Material | FR4、Aluminum Based | ShengyiTG170、IT180、 Teflon、Rogers、FPC |
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| Finish Board Thickness | 0.30 mm~5.0mm | 0.20mm~6.0mm | ||||
| Minimum Core Thickness | 0.15mm(6 mil) | 0.10mm(4 mil) | ||||
| Copper Thickness | Min. 1/2 OZ,Max.4OZ | Min.1/4OZ,Max.15OZ | ||||
| Hole Copper Thickness | Min.20um（0.8mil） | Min.25um（1mil） | ||||
| Panel size | 700*500(Max) | 600*1000mm(Max) | ||||
| Min.Trace Wide&Line Space | 0.10mm(4 mil) | 0.76mm(3mil) | ||||
| Min.Hole Diameter | Drilling/PTH | φ0.3mm (8 mil) | 0,10mm(4 mil) | |||
| Blind hole | 0.1-0.15mm（4mil） | |||||
| Aspect ratio | ≤8:1 | ≤12:1 | ||||
| Solder Mask | color | Green、Black、White、Yellow、Blue、Red、Matte Green、 Matte Black、Clear、Purple |
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| Bridge | min 0.13mm(5 mil) | min 0.1mm(4mil) | ||||
| Dimension | Hole Position | 0.075(3 mil) | 0.05(2 mil) | |||
| Tolerance | Condutor Width(W) | 20% Deviation of Master A/W | 1mil Deviation of Master A/W | |||
| Hole Diameter(H) | NPTH:+/-0.05mm(2 mil) | NPTH:+/-0.05mm(2mil) | ||||
| PTH:+/-0.075(3 mil) | PTH:+/-0.05mm(2 mil ) | |||||
| Outline Dimension | 0.15mm (6 mil) | 0.10 mm(4 mil) | ||||
| Conduotors & Outline(C-O) | 0.15mm (6 mil) | 0.13 mm(5 mil) | ||||
| Warp and Twist | 0.75% | 0.50% | ||||
| Surface Treatment | ||||||
| Leadfree HASL | 3um（min） | Leadfree HASL | 3um（min） | |||
| OSP | 0.2-0.5um | OSP | 0.2-0.5um | |||
| Immersion Silver | 0.15-0.5um | Immersion Silver | 0.15-0.5um | |||
| Immersion Tin | 0.8-1.2um | Immersion Tin | 0.8-1.2um | |||
| Immersion Gold | Au 1-3u” | Immersion Gold | Au 1-10u” | |||
| Hard Gold | Au 5-50u” | |||||
| selective gold | Au 3-150u” | |||||
| Ni/Pd/Au | Pd 4u” Au 4u” | |||||
| V-cut | Board Thickness | min0.40mm(20mil). | min.0.30mm(12mil) | |||
| Remain Thickness | 1/3 board thickness | |||||
| Tolerance | ±0.13mm(5 mil) | ±0.1mm(4mil) | ||||
| Groove Width | 0.50 mm(20 mil) max. | 0.38mm(15mil) max. | ||||
| Groove to Groove | 20mm(787 m il) min. | 10mm(394mil) min. | ||||
| Groove to Trace | 0.45mm(18 mil) min. | 0.38mm(15mil) min. | ||||
| Slot | Slot size tol.L≥2W | PTH Slot:L;+/-0.13(5mil)W:+/-0.08(3 mil) | PTH Slot;L :+/-0.10(4mil) | (1)L=length of slot | ||
| W:+/-0.05(2 mil) | (2)W=width of slot | |||||
| NPTH slot(mm)L+/-0.10(4mil) | NPTH slot(mm)L:+/-0.08(3mil)W:+/-0.05(2 mil) | (3)Min.drill bit size for multi-hit is 0.60mm |
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| Min Spaceing from hole edge to hole edge |
0.30-1.60(Hole Diameter) | 0.15mm(6 mil) | 0.10mm(4 mil) | |||
| 1.61-6.50(Hole Diameter) | 0.15mm(6 mil) | 0.13mm(5 mil) | ||||
| Minimum spacing between hole edge to circuitry pattern |
PTH hole:0.20mm(8mil) | PTH hole:0.13mm(5mil) | PTH hole:0.13(5mil) | |||
| NPTH hole:0.10mm(4mil) | NPTH hole:0.10(4mil) | |||||
| Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil)max. | |
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil)max. | |||
| 8layers: | 0.25mm(9mil)max. | 8layers: | 0.15mm(6mil)max. | |||
| Min.Spacing From Hole Edge to Innerlayer Pattern |
0.225mm(9mil) | 0.15mm(6mil) | ||||
| Min.Spacing From Outline to Innerlayer Pattern |
0.38mm(15mil) | 0.225mm(9mil) | ||||
| Min. board thickness | 4layers:0.40mm(16mil) | 4layers:0.30mm(112mil) | ||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||
| 8-12 layers:+/-0.20mm(8mil) | 8-12 layers:+/-0.15mm(6mil) | |||||
| Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | |||||
| Conductivity | <50Ω(typical:25Ω) | |||||
| Test voltage | 250V | |||||
| Impedance control | Typical: 50Ω+/-10% | |||||