Process Capability

Item Technical Sepecification Remarks
Standard Advanced
Number of layer 1-8 Layers 10-30 Layers
Base Material FR4、Aluminum Based ShengyiTG170、IT180、
Finish Board Thickness 0.30 mm~5.0mm 0.20mm~6.0mm
Minimum Core Thickness 0.15mm(6 mil) 0.10mm(4 mil)
Copper Thickness Min. 1/2 OZ,Max.4OZ Min.1/4OZ,Max.15OZ
Hole Copper Thickness Min.20um(0.8mil) Min.25um(1mil)
Panel size 700*500(Max) 600*1000mm(Max)
Min.Trace Wide&Line Space 0.10mm(4 mil) 0.76mm(3mil)
Min.Hole Diameter Drilling/PTH φ0.3mm (8 mil) 0,10mm(4 mil)
Blind hole 0.1-0.15mm(4mil)
Aspect ratio ≤8:1 ≤12:1
Solder Mask color Green、Black、White、Yellow、Blue、Red、Matte Green、
Matte Black、Clear、Purple
Bridge min 0.13mm(5 mil) min 0.1mm(4mil)
Dimension Hole Position 0.075(3 mil) 0.05(2 mil)
Tolerance Condutor Width(W) 20% Deviation of Master A/W 1mil Deviation of Master A/W
Hole Diameter(H) NPTH:+/-0.05mm(2 mil) NPTH:+/-0.05mm(2mil)
PTH:+/-0.075(3 mil) PTH:+/-0.05mm(2 mil )
Outline Dimension 0.15mm (6 mil) 0.10 mm(4 mil)
Conduotors & Outline(C-O) 0.15mm (6 mil) 0.13 mm(5 mil)
Warp and Twist 0.75% 0.50%
Surface Treatment
Leadfree HASL 3um(min) Leadfree HASL 3um(min)
OSP 0.2-0.5um OSP 0.2-0.5um
Immersion Silver 0.15-0.5um Immersion Silver 0.15-0.5um
Immersion Tin 0.8-1.2um Immersion Tin 0.8-1.2um
Immersion Gold Au 1-3u” Immersion Gold Au 1-10u”
Hard Gold Au 5-50u”
selective gold Au 3-150u”
Ni/Pd/Au Pd 4u” Au 4u”
V-cut Board Thickness min0.40mm(20mil). min.0.30mm(12mil)
Remain Thickness 1/3 board thickness
Tolerance ±0.13mm(5 mil) ±0.1mm(4mil)
Groove Width 0.50 mm(20 mil) max. 0.38mm(15mil) max.
Groove to Groove 20mm(787 m il) min. 10mm(394mil) min.
Groove to Trace 0.45mm(18 mil) min. 0.38mm(15mil) min.
Slot Slot size tol.L≥2W PTH Slot:L;+/-0.13(5mil)W:+/-0.08(3 mil) PTH Slot;L :+/-0.10(4mil) (1)L=length of slot
W:+/-0.05(2 mil) (2)W=width of slot
NPTH slot(mm)L+/-0.10(4mil) NPTH slot(mm)L:+/-0.08(3mil)W:+/-0.05(2 mil) (3)Min.drill bit size for
multi-hit is 0.60mm
Min Spaceing from hole edge to
hole edge
0.30-1.60(Hole Diameter) 0.15mm(6 mil) 0.10mm(4 mil)
1.61-6.50(Hole Diameter) 0.15mm(6 mil) 0.13mm(5 mil)
Minimum spacing between hole
edge to circuitry pattern
PTH hole:0.20mm(8mil) PTH hole:0.13mm(5mil) PTH hole:0.13(5mil)
NPTH hole:0.10mm(4mil) NPTH hole:0.10(4mil)
Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil)max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil)max.
8layers: 0.25mm(9mil)max. 8layers: 0.15mm(6mil)max.
Min.Spacing From Hole Edge to
Innerlayer Pattern
0.225mm(9mil) 0.15mm(6mil)
Min.Spacing From Outline to
Innerlayer Pattern
0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.40mm(16mil) 4layers:0.30mm(112mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm(8mil) 8-12 layers:+/-0.15mm(6mil)
Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
Conductivity <50Ω(typical:25Ω)
Test voltage 250V
Impedance control Typical: 50Ω+/-10%